IEEE Nanotechnology Materials and Devices Conference (NMDC)
IEEE

Archive for the ‘2021’ Category

Plans for IEEE NMDC Conferences due to COVID-19 Pandemic

Friday, April 23rd, 2021

The status of the IEEE-NMDC Conferences impacted by the COVID-19 pandemic:

  • IEEE NMDC 2020 originally planned in Nanjing, China became a virtual symposium on October 26-27; the organizers will now host  NMDC 2022 on October 16-19, 2022, still in Nanjing.
  • IEEE NMDC 2021, colocated with CEIDP 2021, is planned to be held at the Pinnacle Harbourfront Hotel, Oct. 17-20, 2021, Vancouver, Canada.

Please note that due to COVID-19, we may face uncertainty related to travel options and restrictions as well as economic impacts. While we have planned for a face-to-face meeting, we are prepared to take contingency steps that include provisions for remote participation and attendance. Updates will be provided at the IEEE NMDC 2021 website.

  • IEEE NMDC 2023 will be held in Italy.

Solicitation of hosting proposals is open for IEEE NMDC 2024.

NMDC 2021 Abstracts Deadline Extended

Friday, April 16th, 2021

The submission deadline for Short Abstracts has been extended to May 15, 2021.

See Call for Papers page for details.

Prospective authors are invited to submit high quality papers reporting original results under the broad theme, and in all areas of nanotechnology materials and devices Best Conference Papers and Best Student Papers will be awarded Information for Authors including Submission Instructions and requirements can be found on these pages.

 

Announcing NMDC 2021 Call for Papers

Sunday, October 25th, 2020

16th IEEE Nanotechnology Materials and Devices Conference (IEEE NMDC 2021) Call for Papers

IEEE NMDC 2021 sponsored by IEEE Nanotechnology Council (NTC) will be held in the Pinnacle Harbourfront Hotel located in the center of Vancouver, BC, Canada from October 17th to 20th, 2021. The conference will be co-located with another conference – IEEE CEIDP (Conference on Electrical Insulation and Dielectric Phenomena) sponsored by IEEE Dielectrics and Electrical Insulation Society (DEIS).

IEEE NMDC is a well-received international conference and has been held annually rotating in different parts of the world, having the last two editions in Stockholm, Sweden in 2019 and Virtually (due to COVID-19 restrictions) in 2020. IEEE NMDC aims to highlight current work and future directions in nanotechnology-related research in the areas of nanomaterials and fabrications, nanoelectronics, nano-energy, packaging, nanophotonics, bioengineering, modeling and simulation, devices, and integration. This conference brings together key researchers from every sector in the nanotechnology research field, with a special focus on materials and devices.

CALL for PAPERS

The technical program for NMDC 2021 provides a wide variety of topics that emphasize the role of nanoscale phenomena, materials and devices in established and emerging technological areas. Before submitting abstracts, researchers are encouraged to examine the Technical Program Areas to identify the ones that most closely reflect the emphasis of their work.

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Deji Akinwande

Sunday, October 25th, 2020

Adventures with Atomic Materials: from Flexible/Wearable Electronics to Memory Devices

Deji Akinwande, University of Texas – Austin

Abstract:

This talk will present our latest research adventures on 2D nanomaterials towards greater scientific understanding and advanced engineering applications. In particular, the talk will highlight our work on flexible electronics, zero-power devices, monolayer memory (atomristors), non-volatile RF switches, and wearable tattoo sensors. Non-volatile memory devices based on 2D materials are an application of defects and is a rapidly advancing field with rich physics that can be attributed to sulfur vacancies or metal diffusion. Atomistic modeling and atomic resolution imaging are contemporary tools under use to elucidate the memory phenomena. Likewise, from a practical point, electronic tattoos based on graphene have ushered a new material platform that has highly desirable practical attributes including optical transparency, mechanical imperceptibility, and is the thinnest conductive electrode sensor that can be integrated on skin for physiological measurements. Much of these research achievements have been published in nature, advanced materials, IEEE and ACS journals.

Bio:

Deji Akinwande is an Endowed Full Professor at the University of Texas at Austin. He received the PhD degree from Stanford University in 2009. His research focuses on 2D materials and nanoelectronics/technology, pioneering device innovations from lab towards applications. Prof. Akinwande has been honored with the 2019 Fulbright Specialist Award, 2017 Bessel-Humboldt Research Award, the U.S Presidential PECASE award, the inaugural Gordon Moore Inventor Fellow award, the inaugural IEEE Nano Geim and Novoselov Graphene Prize, the IEEE “Early Career Award” in Nanotechnology, the NSF CAREER award, several DoD Young Investigator awards, and was a past recipient of fellowships from the Kilby/TI, Ford Foundation, Alfred P. Sloan Foundation, 3M, and Stanford DARE Initiative. His research achievements have been featured by Nature news, Time magazine, BBC, Discover magazine, and many media outlets. He serves as an Editor for the IEEE Electron Device Letters and Nature NPJ 2D Materials and Applications. He Chairs the 2020 Gordon Research Conference on 2D materials, and was the past chair of the 2019 Device Research Conference (DRC), and the 2018 Nano-device committee of IEEE IEDM Conference. He is a Fellow of the IEEE and the American Physical Society (APS).

 

David Gracias

Sunday, October 25th, 2020

3D Nanofabrication by curving, bending, and folding

David Gracias, Professor, Department of Chemical and Biomolecular Engineering, Johns Hopkins University

Abstract:

Conventional VLSI lithographic patterning approaches have revolutionized modern engineering, but they are inherently planar. Recently, researchers have discovered that the interplay between out-of-plane stresses, capillary forces or swelling vs bending rigidity of patterned thin films can be engineered so as to cause spontaneous 2D to 3D shape transformations by curving, bending, and folding in a reproducible and high-throughput manner.

In this talk, the design, assembly, and characterization of such 3D nanostructured materials and devices will be described. The emphasis of our approach has been on enabling mass-production of lithographically micro, nano, and smart 3D devices in a high-throughput manner with diverse materials such as 2D layered materials (e.g. graphene, MoS2), silicon and related materials, polymers (e.g. SU8) and hydrogels. By leveraging the precision of planar lithography approaches such as photo, e-beam, and nanoimprint methodologies, a range of functional patterns can be incorporated into these thin film self-assembling systems so as to provide enhanced functionality for optics, electronics, and medicine. Assembled devices include metamaterials, flexible biosensors, curved microfluidics, drug-delivery capsules, anatomically realistic models for tissue engineering, antennas, e-blocks, sensors, soft-robotic actuators, and untethered surgical tools.

Biography:

David Gracias is a Professor at the Johns Hopkins University (JHU) in Baltimore. He did his undergraduate at the Indian Institute of Technology, received his PhD from UC Berkeley, did post-doctoral research at Harvard University and worked at Intel Corporation prior to starting his independent laboratory at JHU in 2003. Prof. Gracias has pioneered the development of 3D, integrated micro and nanodevices using a variety of patterning, self-folding and self-assembly approaches.  He has co-authored over 190 technical articles, holds 33 issued patents and has delivered over 100 invited technical talks. Prof. Gracias has received a number of major awards including the NIH Director’s New Innovator Award, Beckman Young Investigator Award, NSF Career Award, Camille Dreyfus Teacher Scholar Award, Beckman Young Investigator Award, and Friedrich Wilhelm Bessel Award. He is a Fellow of the American Institute for Medical and Biological Engineering (AIMBE), Royal Society of Chemistry (RSc), American Association for the Advancement of Science (AAAS) and the Institute of Electrical and Electronics Engineers (IEEE).