IEEE Nanotechnology Materials and Devices Conference (NMDC)
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Archive for the ‘2021’ Category

Announcing NMDC 2021 Call for Papers

Sunday, October 25th, 2020

16th IEEE Nanotechnology Materials and Devices Conference (IEEE NMDC 2021) Call for Papers

IEEE NMDC 2021 sponsored by IEEE Nanotechnology Council (NTC) will be held in the Pinnacle Harbourfront Hotel located in the center of Vancouver, BC, Canada from October 17th to 20th, 2021. The conference will be co-located with another conference – IEEE CEIDP (Conference on Electrical Insulation and Dielectric Phenomena) sponsored by IEEE Dielectrics and Electrical Insulation Society (DEIS).

IEEE NMDC is a well-received international conference and has been held annually rotating in different parts of the world, having the last two editions in Stockholm, Sweden in 2019 and Virtually (due to COVID-19 restrictions) in 2020. IEEE NMDC aims to highlight current work and future directions in nanotechnology-related research in the areas of nanomaterials and fabrications, nanoelectronics, nano-energy, packaging, nanophotonics, bioengineering, modeling and simulation, devices, and integration. This conference brings together key researchers from every sector in the nanotechnology research field, with a special focus on materials and devices.


The technical program for NMDC 2021 provides a wide variety of topics that emphasize the role of nanoscale phenomena, materials and devices in established and emerging technological areas. Before submitting abstracts, researchers are encouraged to examine the Technical Program Areas to identify the ones that most closely reflect the emphasis of their work.


Elena A. Rozhkova

Sunday, October 25th, 2020

Merging Nanotechnology & Synthetic Biology toward Directed Evolution of Energy Materials

Elena A. Rozhkova, Argonne National Laboratory


The biological use of solar energy for synthesis of fuels from water and carbon dioxide inspires researchers and engineers in their efforts to replace exhaustible energy sources with renewable technologies. Eco-friendly photocatalytic energy conversion, known as artificial photosynthesis, along with inorganic materials, also uses biological structures, such as molecules, enzymes, machineries or whole microorganisms that can capture light, break down water, and reduce carbon dioxide and protons. In this talk, I will show that merging nanotechnology, biotechnology and synthetic biology approaches allows for systemic manipulation at the nanoparticle−bio interface toward directed evolution of energy materials, novel environmentally friendly catalytic, “artificial life” systems and, ultimately, to circular economy. For example, purple membranes isolated from Halobacteria or, more recently, obtained via cell-free synthetic biology approaches, were integrated with TiO2 nanoparticles to produce hydrogen or reduce carbon dioxide to value-added chemicals. These new functions are not typical of the host microorganism. On the other hand, interplay between plasmon resonance of noble metal nanostructures and the natural mechanisms of these light-sensitive membranes in the engineered hollow hybrids led to an “artificial cell” capable of photosynthesis of adenosine triphosphate (ATP), a universal energy-carrying biomolecule.


Elena A RozhkovaDr. Rozhkova earned her Ph.D. in Chemistry at the Moscow State Institute for Fine Chemical Technology. She worked in Japan as a Japan Society for Promotion of Science (JSPS) postdoctoral fellow at the Institute of Multidisciplinary Research for Advanced Materials, Tohoku University. After moving to the US in 2003, she became a research staff member at the Chemistry Department of Princeton University, and later she moved to Chicago. Since joining the Center for Nanoscale Materials at Argonne National Laboratory in 2007, Elena has been focusing on a general theme of Nano-Bio Interfaces, one of the most exciting interdisciplinary research fields of our time. Success in this area can lead to the solution of emerging problems of civilization, for example, to provide alternative sustainable energy, to advance medical technologies in the diagnosis and treatment of incurable diseases. Rozhkova is a recipient of JSPS fellowship (2000), Brain Research Foundation Fay/Frank Women’s Council Award (2007), the U. of Chicago Argonne LLC Board of Governors Distinguished Performance Award and a medal (2013), Prof. M. J. Nanjan Fourth Endowment Lecture Award “For outstanding contributions in the field of nano-biotechnology” (2018). She was named an IEEE Nanotechnology Council Distinguished Lecturer 2021.


David Xu

Sunday, October 25th, 2020

Nanomaterials in Semiconductor Packaging: Challenges and Opportunities

David Xu, Intel


Packaging of semiconductor devices essentially transforms semiconductor devices into functional electronic products. Packaging technology not only establishes the shape, size, and weight of chips, but also determines the chip reliability. While packaging has always been an important technology enabler, in recent years with increasing need for heterogeneous integration, the scope and demand on packaging materials has been expanded to include the newer and increasingly diverse high-density packaging architectures for system in package (SiP). These include 2D and 3D architectures and cover wafer level packaging, integrated passive device (IPD), through silicon via (TSV), 3D packaging, etc. Packaging materials are becoming critical for enabling the heterogeneously integrated next-generation chips and their intra-package and inter-package interconnects. This calls for innovations in packaging materials to deliver the optimized electrical, thermal, and mechanical properties. Certainly, nanomaterials and nanotechnology have been used in packaging technologies for the past few decades, and nanoparticles will continue to play an important role in providing solutions for future packaging challenges and bottlenecks. In this talk, we plan to provide insights into nanomaterials which have demonstrated potentials for electronic packaging applications as well as highlight the emerging nanotechnology trends. We end with a call to all academic and industrial partners to collaborate and deliver on the promise.


David XuDavid Xu received his Ph.D. in Chemistry from Virginia Tech, and M.S. in Polymer Science and Engineering from Lehigh University. David joined Intel in 2004 in Materials Technology Development in Chandler as a Sr. Packaging Engineer developing assembly materials for communication and wireless packages. He went on to lead materials pathfinding and development for various assembly materials for IC packaging over the last 16 years. His area of expertise is in various polymer materials/encapsulant, adhesives, films for IC packaging assembly. He has developed a number of novel materials technologies that have enabled critical Intel assembly package assembly and process. In recent years, he assumed the role of assembly materials pathfinding lead and is responsible for setting strategic direction and developing materials technology roadmap to enable Intel’s next generation heterogonous packaging.


Deji Akinwande

Sunday, October 25th, 2020

Adventures with Atomic Materials: from Flexible/Wearable Electronics to Memory Devices

Deji Akinwande, University of Texas – Austin


This talk will present our latest research adventures on 2D nanomaterials towards greater scientific understanding and advanced engineering applications. In particular, the talk will highlight our work on flexible electronics, zero-power devices, monolayer memory (atomristors), non-volatile RF switches, and wearable tattoo sensors. Non-volatile memory devices based on 2D materials are an application of defects and is a rapidly advancing field with rich physics that can be attributed to sulfur vacancies or metal diffusion. Atomistic modeling and atomic resolution imaging are contemporary tools under use to elucidate the memory phenomena. Likewise, from a practical point, electronic tattoos based on graphene have ushered a new material platform that has highly desirable practical attributes including optical transparency, mechanical imperceptibility, and is the thinnest conductive electrode sensor that can be integrated on skin for physiological measurements. Much of these research achievements have been published in nature, advanced materials, IEEE and ACS journals.


Deji Akinwande is an Endowed Full Professor at the University of Texas at Austin. He received the PhD degree from Stanford University in 2009. His research focuses on 2D materials and nanoelectronics/technology, pioneering device innovations from lab towards applications. Prof. Akinwande has been honored with the 2019 Fulbright Specialist Award, 2017 Bessel-Humboldt Research Award, the U.S Presidential PECASE award, the inaugural Gordon Moore Inventor Fellow award, the inaugural IEEE Nano Geim and Novoselov Graphene Prize, the IEEE “Early Career Award” in Nanotechnology, the NSF CAREER award, several DoD Young Investigator awards, and was a past recipient of fellowships from the Kilby/TI, Ford Foundation, Alfred P. Sloan Foundation, 3M, and Stanford DARE Initiative. His research achievements have been featured by Nature news, Time magazine, BBC, Discover magazine, and many media outlets. He serves as an Editor for the IEEE Electron Device Letters and Nature NPJ 2D Materials and Applications. He Chairs the 2020 Gordon Research Conference on 2D materials, and was the past chair of the 2019 Device Research Conference (DRC), and the 2018 Nano-device committee of IEEE IEDM Conference. He is a Fellow of the IEEE and the American Physical Society (APS).


David Gracias

Sunday, October 25th, 2020

3D Nanofabrication by curving, bending, and folding

David Gracias, Professor, Department of Chemical and Biomolecular Engineering, Johns Hopkins University


Conventional VLSI lithographic patterning approaches have revolutionized modern engineering, but they are inherently planar. Recently, researchers have discovered that the interplay between out-of-plane stresses, capillary forces or swelling vs bending rigidity of patterned thin films can be engineered so as to cause spontaneous 2D to 3D shape transformations by curving, bending, and folding in a reproducible and high-throughput manner.

In this talk, the design, assembly, and characterization of such 3D nanostructured materials and devices will be described. The emphasis of our approach has been on enabling mass-production of lithographically micro, nano, and smart 3D devices in a high-throughput manner with diverse materials such as 2D layered materials (e.g. graphene, MoS2), silicon and related materials, polymers (e.g. SU8) and hydrogels. By leveraging the precision of planar lithography approaches such as photo, e-beam, and nanoimprint methodologies, a range of functional patterns can be incorporated into these thin film self-assembling systems so as to provide enhanced functionality for optics, electronics, and medicine. Assembled devices include metamaterials, flexible biosensors, curved microfluidics, drug-delivery capsules, anatomically realistic models for tissue engineering, antennas, e-blocks, sensors, soft-robotic actuators, and untethered surgical tools.


David Gracias is a Professor at the Johns Hopkins University (JHU) in Baltimore. He did his undergraduate at the Indian Institute of Technology, received his PhD from UC Berkeley, did post-doctoral research at Harvard University and worked at Intel Corporation prior to starting his independent laboratory at JHU in 2003. Prof. Gracias has pioneered the development of 3D, integrated micro and nanodevices using a variety of patterning, self-folding and self-assembly approaches.  He has co-authored over 190 technical articles, holds 33 issued patents and has delivered over 100 invited technical talks. Prof. Gracias has received a number of major awards including the NIH Director’s New Innovator Award, Beckman Young Investigator Award, NSF Career Award, Camille Dreyfus Teacher Scholar Award, Beckman Young Investigator Award, and Friedrich Wilhelm Bessel Award. He is a Fellow of the American Institute for Medical and Biological Engineering (AIMBE), Royal Society of Chemistry (RSc), American Association for the Advancement of Science (AAAS) and the Institute of Electrical and Electronics Engineers (IEEE).